One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
Two Component, High Performance Epoxy for Potting, Sealing, Encapsulating and Casting Featuring Superior Electrical Insulation Properties and Resistance to Thermal Shock and Cycling.
One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 550°F.
Two Component Nickel Conductive Epoxy Adhesive for High Performance Bonding Featuring High Peel Strength, Superior Toughness and Low Volume Resistivity
Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.
