Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system.
Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm2 using a
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition upon exposure to 405 nm LED light, followed by a short 30-45 minute heat cure at 90-95°C, making it well-suited for bonding heat sensitive components.
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The epoxy is formulated with a specialty filler with a particle size ranging from 5 to 30 microns. It is a flowable system with a mixed viscosity of 45,000-65,000 cps at room temperature.
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency.
Supreme 121AOND not only provides excellent chemical resistance, but also offers a high glass transition temperature (Tg) of 200-210°C.
Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting.
While most if not all epoxies will yellow over time, especially upon exposure to heat and intense UV light, EP21LSCL-2Med has been designed