One Component, Silver Conductive Epoxy Adhesive Featuring High Shear and High Peel Strengths. Uniquely Special System Cures between 175°F and 185°F with Physical Strength Properties and Excellent Conductivity.
Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.
Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.
One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
Two Component, Thermally Conductive Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.
One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
