Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.
Two Component, Nickel Modified Room Temperature Curing Polymer System Featuring High Electrical Conductivity, Superior Bonding Strength and Chemical Resistance For EMI/RFI Shielding As Well As Bonding, Sealing and Encapsulation Applications.
Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation
Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Conforms to FDA Section 175.105 for Indirect Food Applications.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
Two Component, Optically Clear, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation & Casting. Features Excellent Adhesion To Glass, Polycarbonates, And Acrylics.
Quartz Filled, Two Component Epoxy System for High Performance Bonding, Sealing, Coating & Casting, Featuring Exceptionally Low Shrinkage and High Dimensional Stability.
