One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Thoroughly Non-Drip Formulation.
Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing, Low Viscosity Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offering Superior Chemical Resistance and Excellent Physical Strength Properties.
Two Component, Room Temperature Curing Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offers Outstanding Chemical Resistance along with Superior Physical Strength Properties.
Two Component Epoxy Resin System for Bonding, Coating and Sealing, Formulated for Outstanding Abrasion Resistance; Features High Shore D Hardness and Convenient One to One Mix Ratio.
One Component, Room Temperature Curing, Silicone Elastomer Adhesive for High Performance Bonding and Sealing; Featuring Flame Retardancy and Very Fast, Non-Corrosive Cure.
Two Component, Low Viscosity Epoxy System for Bonding, Sealing, Coating and Encapsulation with Excellent Physical and Electrical Insulation Properties. Featuring Superb Optical Clarity and Light Transmission.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System.
