Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F.
Optically Clear, Two Component Epoxy Adhesive for High Performance Bonding, Coating, Sealing and Casting Featuring Superior Non-Yellowing Properties, Low Viscosity and Rapid Curing.
Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.
Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications
Two Component, Room Temperature Curing Epoxy for Bonding, Sealing, Coating & Encapsulation with Exceptional Thermal Conductivity, Electrical Isolation and High Temperature Resistance.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Bonding, Potting, Sealing & Coating. Offers High Temperature Resistance & Excellent Thermal Properties along with Good Flow.
