Epoxy

EP34 Product Information

EP34 Two Component Epoxy

Two Component, Room Temperature Curing Epoxy System For High Temperature Potting & Encapsulation Applications

EP34AN Product Description

EP34AN Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Exceptionally High Thermal Conductivity.

EP34AO Product Description

EP34AO Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy System Featuring High Temperature Resistance And Excellent Thermal Conductivity.

EP34CA Product Information

EP34CA Two Part Epoxy

Two Component Epoxy Resin System for High Pertormance Applications

EP35 Product Information

EP35 Two Part Epoxy

Two Component, Room Temperature Curing Epoxy Adhesive For High Temperature Bonding Applications

EP35SP Product Information

EP35SP Two Part Epoxy

Two Component, Heat Curing Epoxy Adhesive For High Temperature Bonding Applications

EP35SP Type V Product Information

EP35SP Type V Two Part Epoxy

Two Component, Heat Curing Epoxy Adhesive For High Temperature Bonding Applications

EP35TDC Product Description

EP35TDC Two Part Epoxy

Two Component, High Viscosity, Room Temperature Curing Epoxy Adhesive For High Temperature Bond Applications

EP36 Product Information

EP36 One Part B-Stage Epoxy

One Component, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications. B-Stage Epoxy Is Available in 30 Gram Cookies.

EP36AN Product Information

EP36AN One Component, B-stage Epoxy

One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Very High Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.

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