Chemically Resistant

Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets USP Class VI and ISO 10993-5 Specifications.

One Component, High Viscosity LED Curable System for Bonding, Sealing, Coating and Encapsulation, Cures Completely at 405 nm Wavelength up to 1/8 Inch Thick; Cures Tack-Free Without Any Oxygen Inhibition; Excellent Physical Properties; White Color, Opaque System.

Room Temperature Curing, Urethane Modified Epoxy Gel-Like System for Sealing and Encapsulation Cures To a Low Shore A Hardness Ideal for Retrievability

One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing, Coating and Casting Featuring Excellent Physical Properties and Dimensional Stability with a Remarkably High Glass Transition Temperature Greater Than 180°C.