Chemically Resistant

EP21TDCSFL Product Information

EP21TDCSFL Two Part Conductive Epoxy

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.

EP21TPFL-1 Product Information

EP21TPFL-1 Two Component Epoxy Polysulfide

Two Component, Low Viscosity Epoxy Polysulfide Compound for High Performance Bonding, Sealing, Coating and Casting with Outstanding Resistance to Fuels, Oils and Other Chemicals; Offers Exceptionally High Flexibility.

EP21TPFL-1AO Product Information

EP21TPFL-1AO Two Part Epoxy Polysuifide System

Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System for High Performance Bonding, Sealing, Coating and Casting; Outstanding Resistance to Fuels and Oils with Superior Thermal Conductivity and Electrical Insulation Properties.

EP21TPHTAO Product Description

EP21TPHTAO Two Part Polysulfide/Epoxy

Two Component Thermally conductive Polysulfide/Epoxy Adhesive/Sealant For High Performance Bonding and Sealing

EP22 Product Information

EP22 Two Part Epoxy Adhesive System

Aluminum Filled, Tough, Two Component Epoxy Adhesive for High Performance Bonding, Sealing and Coating with Enhanced Machinability and First Class Dimensional Stability.

EP22P Product Description

Two Component Metallic Epoxy Compound For Repair Of Damaged Metal Structures

EP27 Product Description

High Performance Two Component Epoxy Resin System For Bonding, Sealing Coating And Casting That Cures At Temperatures Below 40°F

EP29 Product Description

Metal Filled, Two Component Room Temperature Curing Epoxy For Industrial Maintenance, Repair, Casting &Amp; Bonding Applications

EP29LP Product Information

EP29LP Two Component Epoxy

Two Component, Very Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Filament Winding with Exceptionally Low Exotherm and Long Working Life.

EP29LPSPAO-1 Black Product Information

EP29LPSPAO-1 Black Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

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