Two Component, Thermally Conductive, Electrically Insulating Epoxy for High Performance Bonding, Sealing and Encapsulation. Features a Glass Transition Temperature in Excess of 200°C; Requires Elevated Temperature Curing at 250°F or Above. Meets NASA Low Outgassing.
Two Component Epoxy System Featuring the Unique Combination of Ultra Fast Setting and Curing Along with High Temperature Resistance. Meets NASA Low Outgassing Specifications.
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Room Temperature Cure and Exceptionally Low Volume Resistivity.
One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Meets NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing, High Temperature Resistant Epoxy Adhesive/Sealant for Service from -112°F to +400°F Featuring High Peel and High Shear Strength. Meets NASA Low Outgassing Specifications.
One Component, High Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Superb Physical Properties, Dimensional Stability and Chemical Resistance with an Exceptionally High Glass Transition Temperature.
