Two Component, Silver Coated Nickel Filled Epoxy for High Performance Bonding, Coating and Sealing Featuring Low Volume Resistivity, High Flexibility, Convenient Handling and Cost Effectiveness.
Two Component, Graphite Filled Electrically Conductive Silicone Compound For High Performance Bonding And Sealing Cures To A Tough Flexible Electrical Conductive Black Rubber
Low Viscosity Silicone Conformal Coating Featuring Fast Tack-Free Cures, Excellent Protection of Electronic Circuitry in High Humidity Environments as well as Resistance to Shock and Vibration
Flexibilized, One Component Epoxy Adhesive/Sealant Featuring Outstanding Shear and Peel Strength; Serviceable from 4°K to 350°F. Requires Minimum Cure Temperature of 250°F.
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding and Sealing. Offers High Shear and Peel Strength, Along With Convenient Handling.
