Thermal Cycling Resistant

Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Superlative Thermal Conductivity Along With Exceptional Electrical Insulation Properties.

Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets USP Class VI and ISO 10993-5 Specifications.

Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulation Featuring High Temperature Resistance, Good Dimensional Stability and Excellent Chemical Resistance.

Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.