EP4UF-80 Product Description

EP4UF-80 One Component Epoxy

One component epoxy for bonding and underfill applications, minimum curing temperature 80°C

EP4EN-80 Product Description

EP4EN-80 One Component Epoxy

One component epoxy for bonding and small encapsulation applications, minimum curing temperature 80°C. Thermally conductive, electrically insulating.

EP51CC Product Information

EP51CC Two Component Epoxy

Two Component Epoxy Adhesive For Fast Curing, High Performance Bonding and Sealing

EP21ARLV Product Information

EP21ARLV Two Component Epoxy

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids and low viscosity.

UV15X-6Med-2LV Product Information

UV15X-6Med-2LV One Part UV Curable System

One Component High Viscosity UV Curable System For Bonding, Sealing, Coating and Casting Featuring High Flexibility and Outstanding Abrasion Resistance Fully meets ISO 10993-5 for Medical Applications, Optical Clarity

EP77M-FMed Product Information

EP77M-FMed Two Part Epoxy

Two Component, Silver Conductive Epoxy Adhesive for High Performance Bonding Featuring Rapid Set Up Time, Superior Bond Strength and Exceptionally Low Volume Resistivity Meets ISO 10993-5 for Cytotoxicity.

EP17HTS-DA Product Information

Electrically Conductive Die Attach Epoxy EP17HTS-DA

One part die attach epoxy has high temperature resistance and electrical conductivity.

EP40Med Product Information

EP40Med Two Part Epoxy

Two Component, Flexible, Low Viscosity Epoxy Compound Meets ISO 10993-5 certification. Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Excellent Adhesion To Engineering Plastics And Metals, Polycarbonates And Acrylics

EP21TPHT Product Information

EP21TPHT Two Part Epoxy

Two component, epoxy polysulfide for bonding, sealing, coating and encapsulation features easy processing

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