EP21TCHT-1 has been used in various applications involving different substrates, service conditions and requirements. Multiple published research articles from University of Florida, Princeton University and NASA, among others make reference to the use of Master Bond EP21TCHT-1.
Two component epoxy compound for high performance bonding and sealing
Key Features
- Thermally conductive, electrically insulative
- Cryogenically serviceable
- High temperature resistant
- Easy to apply, paste consistency
- NASA low outgassing approved
- Withstands 1,000 hours 85°C/85% RH