Adhesives for Medical Electronics

Specially developed adhesives, sealants, conformal coatings and encapsulation compounds have been formulated for the assembly of medical electronic devices. These products consist of one and two component epoxy systems, one and two part silicone compounds, cyanoacrylate and UV curable formulations. These technologically advanced materials offer high reliability, easy processing. and have been tested to meet ISO 10993-5 cytotoxicity and USP Class VI requirements.

Types of Compounds for the Assembly of Medical Devices

Medical electronic devices have greatly enhanced the ability to diagnose, treat and monitor different medical conditions. Master Bond offers the following flexible/semi-flexible/rigid products in low/medium, paste viscosity to meet these critical needs. The most noteworthy feature:

• Electrically conductive pastes
• Electrically insulative pastes
• Thermally conductive/electrically insulative pastes
• Glob top coatings
• Conformal coatings
• Underfill encapsulants

Specific grades feature:

• Low stress
• Low outgassing
• Snap cures
• Ultra low moisture absorption
• Optical clarity

Medical Electronic Coatings and Potting Compounds

Low viscosity one part UV/Visible light cure systems have led the way featuring fast cure speeds upon UV light exposure, superb electrical insulation properties and outstanding physical strength. These low shrinkage formulations contain no solvents and adhere well to a wide range of substrates such as glass, FR4, ceramics, metals, polystyrene, polyurethane. Dual cure formulations have a secondary heat curing mechanism for "shadowed out" areas. These cures can be achieved at 80°C and dual cure products have a high T_g after post curing. Select grades have superior flexibility/toughness, withstand abrasion, aggressive chemicals, repeated sterilization. LED compositions are ideal for bonding to heat sensitive substrates and are tack free after cure. Two component thermally conductive/electrically insulative biocompatible epoxy systems exhibit dimensional stability, a low coefficient of thermal expansion, a flowable consistency and impressive dielectric characteristics for potting/encapsulation. Other epoxy compounds have been designed to withstand multiple repeated cycles of autoclaving, high thermal stability and can be castable in thicknesses exceeding 2-3 inches.

Applications for Master Bond Medical Electronic Device Compounds

Master Bond formulations are employed in a wide range of medical electronic device applications including:

• Hearing aids
• Drug releasing pumps
• Defibrillators
• Fetal and maternal monitors
• Fingertip pulse oximeters
• Neurostimulators

View all USP Class VI certified products