High Temperature Resistant B-Staged Adhesive Film Features Thermal Conductivity and Electrical Insulation

In an effort to mitigate the more complicated preparation associated with B-staged epoxies, Master Bond developed FLM36 for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. This B-staged film eliminates mixing and measuring and is easy to handle.

FLM36 can withstand temperatures up to 500°F and retains its high strength properties upon prolonged exposure to elevated temperature. It bonds well to a variety of substrates including metals, composites, glass and many plastics. Additionally, thermally conductive FLM36 is a superior electrical insulator.

Unlike other heat resistant epoxy systems, FLM36 possesses more flexibility and toughness, which enables it to endure thermal and mechanical shocks as well as thermal cycling. It also has good chemical resistance to water, acids, bases, fuels and oils.

The film has release paper on each side. After the substrates to be bonded are properly prepared, the release paper is removed to expose the adhesive. It’s carefully placed onto the part and pressure is applied. The assembly is lightly fixtured and cured for 1-2 hours at 350°F. The bonded parts should be returned to 75°F before removing the fixtures. FLM36 offers uniform bond line thickness and limited squeeze out during bonding.

This product is offered in three standard sizes: FLM36-4A is 4 x 4 x 0.008 inches, FLM36-8B is 8 x 8 x 0.008 inches and FLM36-12C is 12 x 12 x 0.006 inches. The film can be cut with a pair of sharp scissors into various shapes and sizes. The films are rugged, durable and not prone to cracking. Contrary to most thermoset films of this type, FLM36 does not require freezing or refrigeration.

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