Since sensors work by responding to outside environmental factors such as heat, light or motion, it is crucial to use an adhesive that will not impede on the components’ ability to gather outside information.
Master Bond’s adhesive compounds for sensor applications assist in enhancing the performance properties of sensors with select grades offering impressive values of thermal conductivity, electrical conductivity, electrical insulation and more.
Epoxies and Silicones for Sensor Applications
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UV15DC80Med USP Class VI approved one component UV and heat curable epoxy. Passes ISO 10993-5 cytotoxicity testing. Cures at temperatures as low as 80°C. Moderate viscosity. Minimal shrinkage upon cure. Capable of withstanding liquid sterilants, radiation, autoclaving. Serviceable from -60°F to +400°F. |
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MasterSil 151TC Optically clear, addition curing potting, encapsulation, sealing compound. Low shrinkage upon cure. Resists up to +400°F [+204°C]. Shore A hardness 50-60. Highly resistant to water. Long pot life. Primarily in thermal management applications. |
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EP37-3FLFAO Flexible, low viscosity, thermally conductive epoxy. Meets NASA low outgassing specifications. Superb electrical insulator. Good physical strength. Chemical resistant. Long working life. Withstands 1,000 hours 85°C/85% RH. Guards against mechanical shock and vibration. Excellent flowability. Ideal for potting and casting. |
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EP30Med Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification. |
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EP21TCHT-1 Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH. |
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EP21TDCN-LO Two component nickel conductive epoxy featuring high peel strength, superior toughness and low volume resistivity. Withstands thermal cycling. Meets NASA low outgassing specifications. The service temperature range is -100°F to +275°F. |