Expanded Product List
Master Bond Product Search
356 products match
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EP30LTE-LO Black Two component epoxy system. Low thermal expansion coefficient and dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP30LTE-LO Two component epoxy system. Extra low thermal expansion coefficient and unmatched dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP30LV High performance general purpose adhesive, sealant, casting compound. Low viscosity. Optically clear. High bonding strength. Electrically insulative. Easy to apply. Allows for wicking and capillary action. Room temperature curing. Serviceable from -60°F to +250°F. |
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EP30LV-1 Ultra low viscosity epoxy system. Cures at room temperature. Outstanding optical clarity. Electrically insulative. High strength rigid bonds. Fills gaps in confined areas. Serviceable from -60°F to +250°F. |
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EP30M3LV-2NV Epoxy-urethane blend. Superior toughness and abrasion resistance. Biocompatible. Cryogenically serviceable. Low viscosity. Low moisture absorption and hydrolytic stability. USP Class VI approved. Serviceable from 4k to +250°F. Outstanding electrical insulation properties. Withstands thermal cycling. High impact strength. |
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EP30M3LV-NV Low viscosity epoxy potting/casting compound. Superior electrical insulation properties. Long open time. Low exotherm. Contains special air release agents to prevent bubble formation. Shore D hardness 55-70. Excellent chemical resistance. Serviceable from -60°F to +250°F. |
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EP30M3LVR Potting/casting compound. Cures at ambient temperature. Good flowability. Special additives enhance release of air bubbles. 100% reactive. Superior electrical insulation properties. High physical strength. Chemical resistant. Serviceable from -60°F to +250°F. |
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EP30M4 Potting compound offering low exotherm. Outstanding chemical resistance and electrical insulation properties. Protects against exposure to Skydrol, xylene, 70% sulfuric acid, 98% sulfuric acid, 50% sodium hydroxide and bleach. Cures at ambient temperatures or more quickly at elevated temperatures. |
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EP30M4LV Low viscosity epoxy compound for high performance bonding, sealing, casting and potting. Impressive chemical resistance to acids, bases, fuels oils, solvents and water. Low exotherm. Serviceable from -80°F to +250°F. Superior dielectric strength. Shore D hardness 75-85. Excellent adhesion to similar and dissimilar substrates. |
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EP30Med Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification. |