Master Bond Product Search

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EP30M3LV Two Component Epoxy System EP30M3LV-NV

Low viscosity epoxy potting/casting compound. Superior electrical insulation properties. Long open time. Low exotherm. Contains special air release agents to prevent bubble formation. Shore D hardness 55-70. Excellent chemical resistance. Serviceable from -60°F to +250°F.

EP30M3LVR Two Part Epoxy EP30M3LVR

Potting/casting compound. Cures at ambient temperature. Good flowability. Special additives enhance release of air bubbles. 100% reactive. Superior electrical insulation properties. High physical strength. Chemical resistant. Serviceable from -60°F to +250°F.

EP30M4 Two Part Epoxy EP30M4

Potting compound offering low exotherm. Outstanding chemical resistance and electrical insulation properties. Protects against exposure to Skydrol, xylene, 70% sulfuric acid, 98% sulfuric acid, 50% sodium hydroxide and bleach. Cures at ambient temperatures or more quickly at elevated temperatures.
Moderate viscosity. Service operating temperature range from -80°F to +300°F. Withstands 1,000 hours 85°C/85% RH.

EP30M4LV Two Part Epoxy System EP30M4LV

Low viscosity epoxy compound for high performance bonding, sealing, casting and potting. Impressive chemical resistance to acids, bases, fuels oils, solvents and water. Low exotherm. Serviceable from -80°F to +250°F. Superior dielectric strength. Shore D hardness 75-85. Excellent adhesion to similar and dissimilar substrates.

EP30Med Two Part Epoxy EP30Med

Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification.

EP30ND Two Part Epoxy EP30ND

Light paste. Spreads evenly and smoothly. Superior chemical resistance properties. Cures at room temperatures. Machinable. Service temperature range -60°F to +250°F. High bond strength

EP30NS Two Part Epoxy EP30NS

Moderate viscosity Nanosilica epoxy resin system. High strength rigid bonds. Lower linear shrinkage after cure. Serviceable from -60°F to +300°F. Cures readily at room temperature. Passes ASTM E595 for NASA low outgassing.

EP30P Two Component Epoxy EP30P

Two part, room temperature curing epoxy system with excellent optical transparency. Low viscosity. Bonds extremely well to more sensitive plastics such as polycarbonates and acrylics. Superior electrical insulation properties. Good chemical resistance to oils, fuels, water, hydraulic fluids. Serviceable from -60°F to +250°F.

EP30QF Two Part Epoxy Compound EP30QF

Quartz filled epoxy system. Features high tensile modulus, outstanding compressive strength and superior dimensional stability. Good flow properties. Suitable for potting/encapsulation. Reliable electrical insulator. Low CTE. Service temperature range from -60°F to +250°F. Excellent chemical resistance. Meets NASA low outgassing specifications. Withstands 1,000 hours at 85°C/85% RH.

EP31 Two Component Epoxy System EP31

Ultra high strength, two part epoxy adhesive that bonds well to most metals and plastics. Aluminum to aluminum lap shear strength exceeds 4,000 psi. T-peel strength >50 pli. Ambient temperature curing. Tough and resilient bonds. Combines low viscosity and optical clarity. Serviceable from -60°F to +250°F. Chemical resistant. First class electrical insulator.

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