Expanded Product List
Master Bond Product Search
621 products match
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EP51CC Easy to apply, paste like consistency two component epoxy adhesive. High bond strength. Can be packaged for use in field applications. Serviceable at cryogenic temperatures down to 4K. |
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EP51FL Tough, flexible epoxy adhesive cures rapidly at ambient temperatures. High bond strength. Cryogenically serviceable. Easy to use, one to one mix ratio. |
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EP51FL-1 Flexible epoxy adhesive has rapid set up time and cure speed. High peel strength and elongation. Withstands mechanical shock and vibration. Resists thermal cycling. Superb electrical insulation properties. Service operating temperature range from -100°F to +250°F. |
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EP51FL-1ND-2 Flexible epoxy adhesive has rapid set up time and cure speed. High peel strength and elongation. Withstands mechanical shock and vibration. Resists thermal cycling. Superb electrical insulation properties. Service operating temperature range from -100°F to +250°F. |
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EP51HT Service operating temperature range from 4K to +400°F. Fast room temperature curing epoxy adhesive/sealant. Gels in 5 minutes. Convenient one to one mixing ratio by weight. Bonds well to similar/dissimilar substrates. High tensile lap shear strength. |
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EP51M Rapid curing at room temperature. Fixturing period 7-12 minutes. Convenient one to one mix ratio by weight or volume. High bond strength and long term durability. Withstands 1,000 hours 85°C/85% RH. Serviceable from 4k to +250°F. Available in various viscosities and colors. |
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EP51ND High viscosity paste. Does not drip on vertical surfaces. Fast "5 minute" curing, two component epoxy adhesive. High bond strength. Serviceable from -100°F to +250°F. Superior durability. One to one mix ratio weight or volume. Excellent dielectric properties. |
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EP52TC Low thermal resistance properties. Can be applied in bond lines as thin as 10-15 microns. Low CTE. Low shrinkage upon cure. Serviceable from -100°F to +300°F. Exceptional dimensional stability. |
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EP53TC Low thermal resistance properties. Can be applied in bond lines as thin as 10-15 microns. Low CTE. Low shrinkage upon cure. Serviceable from -100°F to +300°F. Exceptional dimensional stability. |
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EP54TC Very high thermal conductivity over 6 W/(m•K). Combines very high thermal conductivity and robust electrical insulation. Used for bonding and sealing. Paste consistency with long working life. |