Expanded Product List
Master Bond Product Search
621 products match
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MasterSil 153Med Paste consistency. Convenient one to one mix ratio. Elongation 400-500%. Highly water resistant. Self priming feature. Meets USP Class VI and ISO 10993-5 requirements. Superior thermal stability. Resists vibration, shock. Serviceable from -65°F to +400°F. |
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MasterSil 155 Two part, graphite filled silicone adhesive. Convenient one to one mix ratio by weight. Volume resistivity 20-40 ohm-cm. Elongatio >300%. Serviceable from -85°F to +400°F. |
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MasterSil 156 Two part silicone potting/encapsulation compound. Superior thermal conductivity. High elongation. Long pot life. Cures in thicknesses beyond 1-2 inches. UL 94V-0 flame retardant system. Serviceable from -65°F to +221°F. |
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MasterSil 157 Two component low viscosity silicone system. Ideal for potting and encapsulation. Does not require air for curing. Low exotherm; very long pot life. Enhanced low temperature serviceability. Service temperature range of -175°F to +500°F. Superior electrical insulator. |
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MasterSil 170 Gel Two part, low viscosity silicone gel for sealing, potting and encapsulating applications. Outstanding flexibility. Superior electrical insulation properties. Exceptional optical clarity. Serviceable from -67°F to +392°F. |
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MasterSil 323 Two part silicone paste for bonding, sealing and encapsulating applications. Optically clear in thin sections. Outstanding flexibility. Contains no solvents or diluents. Low to moderate viscosity. Low dielectric constant. Addition cured, no by-products released during cure. Serviceable from -65°F to +400°F. |
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MasterSil 323AO-LO Thermally conductive silicone casting, potting and sealing system. Flowable, meets NASA low outgassing specifications. Electrically isolating. Low viscosity system bonds well to a wide variety of substrates. Flexible. Temperature resistant from -65°F to +400°F. White color. |
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MasterSil 323Med Black Two part silicone paste for bonding, sealing and encapsulating applications. Opaque in thin sections. Outstanding flexibility. Contains no solvents or diluents. Low to moderate viscosity. Low dielectric constant. Addition cured, no by-products released during cure. Serviceable from -65°F to +400°F. |
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MasterSil 323Med Two part silicone paste for bonding, sealing and encapsulating applications. Optically clear in thin sections. Outstanding flexibility. Contains no solvents or diluents. Low to moderate viscosity. Low dielectric constant. Addition cured, no by-products released during cure. Serviceable from -65°F to +400°F. |
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MasterSil 323S-LO Addition curing, two part silicone for use as an adhesive, sealant, coating. Passes NASA low outgassing specifications. Serviceable from -80°F to +400°F. Electrically conductive with convenient processing. |