Expanded Product List
Master Bond Product Search
621 products match
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EP21AOLV-2LO Two part, ambient temperature curing epoxy potting/encapsulation compound. Thermally conductive/electrically isolating. Very low exotherm. Suitable for large castings. Meets NASA low outgassing specifications. Service operating temperature range from -60°F to +250°F. Withstands 1,000 hours 85°C/85% RH. |
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EP21AOLV-2Med Meets USP Class VI requirements and passes ISO 10993-5 tests for cytotoxicity. Smooth flowable consistency. Thermally conductive//electrically insulative. Can be used for bonding, sealing, coating, encapsulation. One to one mix ratio. Cures at room temperature. Resists EtO, radiation, and chemical sterilants. Serviceable from -60°F to +250°F. |
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EP21AOND Two component non-drip epoxy adhesive. Thermal conductive/electrically insulative. Versatile cure schedules. High bond strength to similar and dissimilar substrates. Serviceable from -60°F to +250°F. |
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EP21AR Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids. |
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EP21ARHT Serviceable from +400°F. Exceptional acid resistance. Cures at room temperature. Good flow properties. 100% reactive. Low shrinkage upon cure. |
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EP21ARHTND Non-drip paste. Exceptional chemical resistance to acids. High bond strength. 100 to 50 mix ratio by weight. Formulated to cure at ambient temperatures. Used for coating pumps, storage vessels, tanks. Serviceable from -60°F to +400°F. |
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EP21ARHTND-2 Non-drip paste. Exceptional chemical resistance to acids. High bond strength. 100 to 50 mix ratio by weight. Formulated to cure at ambient temperatures.Serviceable from -60°F to +400°F. |
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EP21ARLV Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids. |
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EP21BAS Two component, room temperature curing, radiopaque epoxy adhesive, sealant and coating. Employed for medical diagnostic and therapeutic devices. Effective for even 100 KV, px-ray (peak x-ray) machines and higher energy capacities. Convenient one to one mix ratio. High bond strength. Superior electrical insulation properties. Serviceable from -60°F to +250°F. |
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EP21CLV Two component epoxy adhesive, sealant, coating, potting, casting compound. Convenient one to one mix ratio. Cures at ambient temperatures. Good flow characteristics. Adjustable rigidity and flexibility by altering mix ratio. Durable bonds for similar and dissimilar substrates. Serviceable from -65°F to +250°F. |