LED422DC90 Product Information

LED422DC90 One Part LED and Heat Curing Adhesive

One component, dual curing LED system with a specialty light penetration profile allowing for rapid fixturing and subsequent curing by heat

Supreme 10HTLV Product Information

One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Meets NASA Low Outgassing Specifications.

EP3HT-LO Product Information

One Part Epoxy EP3HT-LO

One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Strength Properties. Meets NASA low outgassing specifications.

Supreme 121AOMed Product Information

Two Part Epoxy Supreme 121AOMed

Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity

EP4NS-80 Product Description

One Part Epoxy System EP4NS-80

One component epoxy for bonding, sealing and coating applications, curing temperature 80°C. Optically clear, NASA low outgassing.

MasterSil 323S-LO Product Information

Master Bond MasterSil 323S-LO Silicone System

Two component, silver filled silicone with superb electrical conductivity along with good heat transfer properties.

Supreme 121AOND Product Information

Supreme 121AOND Two Part Epoxy

Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity

EP30LTE-LO Black Product Information

EP30LTE-LO Two Component Epoxy

Two Component, Black Colored, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.

Supreme 42HT-2ND Black Product Information

Supreme 42HT-2ND Black Two Part Epoxy

Toughened, Two Component Epoxy Adhesive/Sealant Featuring High Temperature and Chemical Resistance; Superior Thermal Cycling Capabilities.

EP4S-80 Product Description

One Part, Silver Filled Epoxy

One component epoxy for bonding, sealing and coating applications, curing temperature 80°C. Electrically conductive, NASA low outgassing.

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