One component epoxy for bonding and underfill applications, minimum curing temperature 80°C
Key Features
- Requires storage in cryogenic freezer at -40°C
- High thermal conductivity
- Good flexibility and toughness
- Low modulus
Product Description
Master Bond EP55TCFL is a one component, pre-mixed and frozen epoxy featuring exceptional thermal conductivity and electrical insulation. It is shipped at -40°C and should be stored at that temperature in a cryogenic freezer. Upon thawing, the working life is about 3-4 hours. It has a moderate viscosity and spreads evenly and smoothly when bonding. Curing is straight forward with two cure schedule options: 4-6 hours at 50-70°C or 3-4 hours at 80-90°C. It has outstanding dimensional stability and low shrinkage upon curing.
EP55TCFL bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It resists waters, oils and fuels. It is gray in color, and has a service temperature range of -50°C to +125°C. The system is noteworthy for its toughness, low modulus and thermal cycling capabilities. Its good flow properties make it well-suited for small potting and encapsulation applications, where it can be applied in layers up to 1/4 inch thick.
EP55TCFL has a special thermally conductive filler with small particle sizes, which allows it to be applied in very thin bond lines. This results in lower thermal resistance and increases the heat transfer properties of the system. As such, it is a highly effective thermal interface material for bonding applications in microelectronic packaging and assembly.
Product Advantages
- Single component; no mixing needed
- Versatile cure schedules
- Small particle size lowers thermal resistance
- High thermal conductivity and electrically insulating
- NASA low outgassing
Industrial Certifications
Packaging
EP55TCFL is available is various sizes and units to accommodate customer's needs.
