ASTM E595 Compliant

Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications. Passes NASA low outgassing. Cryogenically Serviceable.

Two Component, Thermally Conductive, Electrically Insulating Epoxy for High Performance Bonding, Sealing and Encapsulation. Features a Glass Transition Temperature in Excess of 200°C; Requires Elevated Temperature Curing at 250°F or Above. Meets NASA Low Outgassing.

Two Component Epoxy System Featuring the Unique Combination of Ultra Fast Setting and Curing Along with High Temperature Resistance. Meets NASA Low Outgassing Specifications.

One Component Thermally Conductive, Electrically Insulative Epoxy Adhesive Film Featuring Convenient Handling, Good Storage Stability & Fast Cure