One Component, Toughened Epoxy Adhesive/Sealant Offers Highly Desirable Combination of Properties Including High Peel and Shear Strengths, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Features Good Flow Properties. NASA low outgassing approved.
Two Component, Room Temperature Curing, High Temperature Resistant Epoxy Adhesive/Sealant for Service from -112°F to +400°F Featuring High Peel and High Shear Strength. Meets NASA Low Outgassing Specifications.
One Component, High Viscosity UV Curable System for High Performance Bonding, Sealing and Coating, Featuring Superb Physical Properties, Dimensional Stability and Chemical Resistance with an Exceptionally High Glass Transition Temperature.
One Component, High Strength, UV Curable Epoxy Resin Compound for High Performance Bonding, Coating and Sealing with Unsurpassed Thermal Stability, Low Shrinkage and Optical Clarity; Exceptionally Reactive and Very Fast Curing.
One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.
One Component, Moderate Viscosity, UV-Curable System for Bonding, Sealing and Encapsulation Featuring Superior Chemical Resistance. Meets NASA Low Outgassing Requirements.
