Epoxy

Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Superlative Thermal Conductivity Along With Exceptional Electrical Insulation Properties.

Two Component Epoxy Resin System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures at Moderately Elevated Temperatures and Chemical and High Temperature Resistance. Passes NASA Low Outgassing Tests.

Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulation Featuring High Temperature Resistance, Good Dimensional Stability and Excellent Chemical Resistance.

One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Thoroughly Non-Drip Formulation.