EP17TF Product Information

EP17TF One Part Epoxy System

One Component, Toughened Heat Curing Structural Adhesive/Sealant Featuring Outstanding Strength, Chemical and High Temperature Resistance for Service Up To 550°F

EP19HT Product Information

EP19HT One Component Epoxy System

One Component, Storage Stable Epoxy Resin System for Durable High Performance Adhesive/Sealants, Impregnants and Liners

EP19HTFL Product Information

EP19HTFL One Part Epoxy

One Component, Flexibilized Epoxy Resin System For Durable High Performance Adhesive/Sealants, Impregnants and Liners, with Good Storage Stability

EP21 Product Information

EP21 Two Component Epoxy Compound

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.

EP21AN Product Information

EP21AN Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy Adhesive, Sealant & Coating Featuring a Convenient One to One Mix Ratio, Exceptionally High Thermal Conductivity and Excellent Electrical Insulation Properties.

EP21ANHT Product Information

EP21ANHT Two Part Epoxy Compound

Two Component, Room Temperature Curing Epoxy Adhesive, Sealant and Coating Featuring Exceptional Thermal Conductivity, Excellent Electrical Insulation Properties and High Temperature Resistance.

EP21AO Product Information

EP21AO Two Component Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.

EP21AOHT Product Information

EP21AOHT Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a 1:1 Mix Ratio and High Temperature Resistance Up To 400°F

EP21AOHTLV Product Description

EP21AOHTLV Two Part Epoxy

Two Component Heat Resistant Epoxy Adhesive, Sealant, Encapsulant With High Thermal Conductivity, and Excellent Dimensional Stability Up to 400°F Service

EP21AOLV-1 Product Information

EP21AOLV-1 Two Part Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

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