One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. May be utilized for impregnation applications and spin coating.
Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity
Two Component, Flexible, Moderate Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding And Sealing. High strength structural bonding. NASA low outgassing.
Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock with a paste consistency.
One component die attach epoxy system with exceptionally high glass transition temperature. Resists temperatures up to +600°F. Thermally conductive, electrically insulating, Paste consistency.
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.
