Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.

Two component, quartz filled epoxy system for bonding, sealing and casting features high temperature resistance and withstands abrasion

Low Viscosity, Two Component Epoxy For High Performance, Bonding, Sealing, and Potting Applications. Featuring Excellent Flexibility and Thermal Cycling Capabilities. Urethane modified epoxy, available in many colors. Available in cans or with a gun type dispensing systems

One component epoxy for bonding and small encapsulation applications, minimum curing temperature 80°C. Thermally conductive, electrically insulating.