Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
One Component, No Mix, Very Low Viscosity System Featuring Outstanding Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Well Suited for Resisting a Wide Variety of Chemicals at Higher Temperatures.
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation. Magnificent Structural Adhesive Properties and Exceptional Thermal Cycling Capabilities.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Excellent Thermal Conductivity Along With Exceptional Electrical Insulation Properties.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability Along With Exceptional Electrical Insulation Properties.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Superlative Thermal Conductivity Along With Exceptional Electrical Insulation Properties.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets USP Class VI and ISO 10993-5 Specifications.
