Electrically Insulative

Two Component Nanosilica Reinforced Epoxy Resin System Featuring Outstanding Mechanical Properties, Excellent Electrical Insulation, Superior Abrasion Resistance & Hardness as well as Optical Clarity for Coating, Casting, Potting, Encapsulation & Sealing for Services from -100°F to 500°F!

Two component epoxy for potting, encapsulation, coating and sealing applications

One Component, Heat Curing Structural Adhesive Featuring High Tensile Shear Strength and High Temperature Resistance for Optimal Bonding Performance Up To 450°F

One Component, Heat Curing Epoxy Featuring "Snap Curing" Along with High Temperature Resistance up to 400°F; Can Cure in Sections up to ¼ Inch Thick.