Two Component, Heat Resistant Epoxy Adhesive for High Performance General Purpose Bonding, Outstanding High Thermal Conductivity, Excellent Dimensional Stability Up to 250°F Service Featuring Both High Shear and High Peel Strength
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength
Toughened Thermally Conductive Electrically Insulating Two Component Epoxy System For High Performance General Purpose Bonding, Sealing and Casting Featuring Superior Flowability and High Temperature Resistance
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding Applications Up To 425°F. Features Convenient Handling
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding and Sealing. Offers High Shear and Peel Strength, Along With Convenient Handling.
