One Component, Thermally Conductive, Low Temperature Heat Curing Epoxy Adhesive Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance.
One Component, Fast Curing, Toughened Epoxy for Bonding, Sealing and Coating Featuring Excellent Thermal Conductivity and Very Good Electrical Insulation Properties. Can Withstand Rigorous Thermal Cycling.
One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.
One Component, Toughened Epoxy Adhesive, Sealant and Coating Featuring High Shear and High Peel Strengths. Uniquely Special System Cures at 175°F with Superior Adhesive Properties and Outstanding Thermal Cycling Capabilities.
One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Widely Used in Downhole, Oil Processing and Other Petrochemical Applications.
Two Component Fast Curing Heat Resistant Toughened Epoxy Adhesive Featuring High Shear Strength, Superior Dimensional Stability, Good Chemical Resistance, Excellent Impact and Shock Resistance for Superior Bonding
One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.
One Component, UV Curable System for High Performance Coating, Bonding and Sealing, Featuring Excellent Physical Properties and Dimensional Stability; Exceptionally Low Viscosity; Ideal for Applications Involving Spin Coating.
One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability. Meets USP Class VI Specifications.
