Dimensionally Stable

One Component, Low Viscosity UV Curable System for High Performance Bonding, Sealing & Coating, Featuring Excellent Physical Properties and Dimensional Stability.

One Component, Nanosilica Filled UV Curable Epoxy System with Superb Optical Clarity, Abrasion Resistance and Dimensional Stability for Bonding, Sealing, Coating and Encapsulation. Exceptionally Low Shrinkage.

Two Component, Thermally Conductive Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications.

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.