Two Component, Low Viscosity, Silicone Compound for High Performance Casting, Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Outstanding Flexibility and Unsurpassed Thermal Conductivity.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Encapsulation Featuring Very Low Exotherm and a Long Working Life.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
One Component, Electrically Conductive, Room Temperature Curing, Non-Corrosive Silicone for High Performance Bonding, Sealing and Coating with Carbon Filler.
One Component, No Mix, Very Low Viscosity System Featuring Outstanding Electrical Insulation Properties and Excellent Thermal Shock Resistance for Bonding, Sealing, Coating, Encapsulation and Impregnation Applications.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Well Suited for Resisting a Wide Variety of Chemicals at Higher Temperatures.
Two Component, Room Temperature Curing Epoxy System for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Thermal Cycling Capabilities, Excellent Thermal Conductivity Along With Exceptional Electrical Insulation Properties.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets USP Class VI and ISO 10993-5 Specifications.
