One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Thoroughly Non-Drip Formulation.
Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.
One Component, Moderate Viscosity LED Curable System Cures Readily and Tack-Free at 405 nm Wavelength up to 1/8 Inch Thick Without Any Oxygen Inhibition.
Two Component Epoxy Resin System for Bonding, Coating and Sealing, Formulated for Outstanding Abrasion Resistance; Features High Shore D Hardness and Convenient One to One Mix Ratio.
One Component, High Viscosity LED Curable System for High Performance Bonding, Sealing, Coating and Encapsulation, Cures Completely at 405 nm Wavelength up to 1/8 Inch Thick; Cures Tack-Free Without Any Oxygen Inhibition; Excellent Physical Properties.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Paste Consistency, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures
One Component, Room Temperature Curing Silicone Elastomer Adhesive for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.Meets MIL-A-46146 Type 2.
One Component, Room Temperature Curing, Silicone Elastomer Adhesive for High Performance Bonding and Sealing; Featuring Flame Retardancy and Very Fast, Non-Corrosive Cure.
