Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.
Toughened, Two Component Epoxy Adhesive/Sealant Featuring High Temperature and Chemical Resistance; Superior Thermal Cycling Capabilities.
One component, heat curing epoxy for structural bonding applications
One part, thermally conductive, electrically insulating, high performance epoxy for bonding and sealing; meets NASA low outgassing specifications
Two component epoxy compound for bonding, coating, sealing and encapsulation
One component, electrically conductive sodium silicate, aqueous based coating system
